US 12,113,517 B2
Transversely-excited bulk acoustic resonator split ladder filter
Sean McHugh, Santa Barbara, CA (US); Gregory L. Hey-Shipton, Santa Barbara, CA (US); and Garrett Williams, San Mateo, CA (US)
Assigned to Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Mar. 10, 2022, as Appl. No. 17/692,112.
Application 17/692,112 is a continuation of application No. 17/096,841, filed on Nov. 12, 2020, granted, now 11,381,221.
Application 17/096,841 is a continuation of application No. 16/727,304, filed on Dec. 26, 2019, granted, now 10,917,072, issued on Feb. 9, 2021.
Claims priority of provisional application 62/865,798, filed on Jun. 24, 2019.
Prior Publication US 2022/0200575 A1, Jun. 23, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H03H 9/64 (2006.01); H03H 9/02 (2006.01); H03H 9/60 (2006.01); H03H 9/72 (2006.01)
CPC H03H 9/6483 (2013.01) [H03H 9/02559 (2013.01); H03H 9/605 (2013.01); H03H 9/725 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A filter device, comprising:
a first chip comprising:
a first interdigital transducer (IDT) of a first acoustic resonator on a surface of a first piezoelectric diaphragm, interleaved fingers of the first IDT disposed on a portion of the first piezoelectric diaphragm over a first cavity in a first non-piezoelectric base;
a second chip comprising:
a second IDT of a second acoustic resonator on a surface of a second piezoelectric diaphragm, interleaved fingers of the second IDT disposed on a portion of the second piezoelectric diaphragm over a second cavity in a second non-piezoelectric base; and
a circuit card coupled to the first chip and the second chip, the circuit card comprising an electrical connection between the first chip and the second chip,
wherein a thickness of the interleaved fingers of the first IDT is different from a thickness of the interleaved fingers of the second IDT.