US 12,113,508 B2
Resonator device
Masahiro Fujii, Shiojiri (JP); and Tomoyuki Kamakura, Matsumoto (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by Seiko Epson Corporation, Tokyo (JP)
Filed on Dec. 8, 2021, as Appl. No. 17/545,092.
Claims priority of application No. 2020-203956 (JP), filed on Dec. 9, 2020.
Prior Publication US 2022/0182033 A1, Jun. 9, 2022
Int. Cl. H03H 9/00 (2006.01); H03H 9/02 (2006.01); H03H 9/125 (2006.01)
CPC H03H 9/02102 (2013.01) [H03H 9/02047 (2013.01); H03H 9/125 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A resonator device, comprising:
a resonator element that includes an excitation electrode, and that has a first surface on which a first mount electrode and a second mount electrode electrically coupled to the excitation electrode are disposed, and a second surface in a front-back relationship with the first surface;
a base that has a third surface which faces the first surface of the resonator element and on which a first base electrode and a second base electrode are disposed;
a lid that has a fourth surface which faces the second surface of the resonator element, and that is bonded to the base so as to accommodate the resonator element;
a first metal bump by which the first mount electrode and the first base electrode are bonded and electrically coupled;
a second metal bump by which the second mount electrode and the second base electrode are bonded and electrically coupled; and
a bonding member by which the second surface and the fourth surface are bonded, wherein
a loss tangent of the bonding member at a room temperature is larger than a loss tangent of the first metal bump and the second metal bump at the room temperature.