a stack including a plurality of dielectric layers that are stacked together;

a first inductor integrated with the stack and wound about a first axis orthogonal to a stacking direction of the plurality of dielectric layers; and

a second inductor integrated with the stack and wound about a second axis orthogonal to the stacking direction, wherein

an area of a first region obtained by perpendicularly projecting a first space including the first axis and surrounded by the first inductor onto a virtual plane perpendicular to the first axis and an area of a second region obtained by perpendicularly projecting a second space including the second axis and surrounded by the second inductor onto a virtual plane perpendicular to the second axis are different from each other,

the second inductor is disposed such that at least part of the second space overlaps part of the first space in a view in one direction parallel to the second axis,

the first inductor includes a first through hole column, a second through hole column, a first conductor layer portion, a second conductor layer portion, and a third conductor layer portion,

the first through hole column and the second through hole column are each constituted by two or more through holes connected in series to each other,

the first conductor layer portion, the second conductor layer portion, and the third conductor layer portion each include at least one conductor layer,

the first conductor layer portion connects one end of the first through hole column and one end of the second through hole column,

the second conductor layer portion is connected to another end of the first through hole column, extends close to another end of the second through hole column, and is not connected to the second through hole column, and

the third conductor layer portion is connected to the another end of the second through hole column, extends close to the another end of the first through hole column, and is not connected to the first through hole column.