US 12,113,329 B2
Stem for semiconductor package including eyelet and lead
Masao Kainuma, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Dec. 20, 2021, as Appl. No. 17/645,099.
Claims priority of application No. 2020-218892 (JP), filed on Dec. 28, 2020.
Prior Publication US 2022/0205628 A1, Jun. 30, 2022
Int. Cl. H01S 5/0231 (2021.01); F21V 31/00 (2006.01); H01L 23/13 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 23/14 (2006.01)
CPC H01S 5/0231 (2021.01) [F21V 31/005 (2013.01); H01L 23/13 (2013.01); H01L 23/142 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A stem for a semiconductor package, comprising:
an eyelet having a through hole formed therethrough;
a lead extending through the through hole; and
a sealing part configured to seal the through hole around the lead,
wherein a main material of the eyelet has a nickel content of 45% and an iron content of 55%, and
wherein a thermal expansion coefficient of the eyelet is greater than a thermal expansion coefficient of the sealing part.