US 12,113,324 B2
Housing of an electronic module and production thereof
Christoph Nöth, Nuremberg (DE); and Marius Münzinger, Nuremberg (DE)
Assigned to Siemens Aktiengesellschaft, Munich (DE)
Appl. No. 17/764,437
Filed by Siemens Aktiengesellschaft, Munich (DE)
PCT Filed Jun. 18, 2020, PCT No. PCT/EP2020/066844
§ 371(c)(1), (2) Date Mar. 28, 2022,
PCT Pub. No. WO2021/063551, PCT Pub. Date Apr. 8, 2021.
Claims priority of application No. 19200557 (EP), filed on Sep. 30, 2019.
Prior Publication US 2022/0407275 A1, Dec. 22, 2022
Int. Cl. H01R 13/405 (2006.01); B29C 45/14 (2006.01); H01R 43/18 (2006.01); H01R 43/24 (2006.01); B29L 31/34 (2006.01)
CPC H01R 43/24 (2013.01) [B29C 45/14221 (2013.01); B29C 45/14467 (2013.01); H01R 43/18 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/3481 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method for producing a housing of an electronic module, said method comprising:
injection molding a lead with a bondable lead surface with a plastic in a plastic injection mold such as to leave at least a part of each bondable lead surface from being injection molded and to form the lead with a pin recess which passes through the plastic and comprises a lead recess in the lead and which is sealed on opposing sides by a stamp component and a matrix component of the injection molded tool when the injection molded tool is closed, with the stamp component and the matrix component being injection molded after the injection molded tool is closed; and
inserting an electrically conductive pin element into the pin recess such as to guide the pin element through the lead recess of the pin recess.