	US 12,113,321 B1
	Terminal
Shigenobu Sekine, Tokyo (JP)
Assigned to Napra Co., Ltd., Tokyo (JP)
Filed by Napra Co., Ltd., Tokyo (JP)
Filed on Sep. 14, 2023, as Appl. No. 18/368,200.
Claims priority of application No. 2023-063460 (JP), filed on Apr. 10, 2023.
Int. Cl. H01R 4/58 (2006.01); H01B 1/02 (2006.01); H01R 13/03 (2006.01)

CPC H01R 4/58 (2013.01) [H01B 1/026 (2013.01); H01R 13/03 (2013.01)]

6 Claims

1. A terminal having a plating layer formed on a surface of a base,

the plating layer having a structure in which an intermetallic compound crystal that contains Sn, Cu, Cr and Ni, is dispersed in a parent phase that contains Sn and an Sn—Cu alloy,

wherein the intermetallic compound crystal has a chemical composition represented by:

50 to 70% by mass of Sn;

30 to 50% by mass of Cu;

0.001 to 3% by mass of Cr; and

0.01 to 6.5% by mass of Ni.