US 12,113,310 B2
Connectors using shape memory alloy
Brett R. Herdendorf, Mound, MN (US); Riyan Alex Mendonsa, Edina, MN (US); Wolfgang Rosner, Shakopee, MN (US); and Krishnan Subramanian, Shakopee, MN (US)
Assigned to Seagate Technology LLC, Fremont, CA (US)
Filed by Seagate Technology LLC, Fremont, CA (US)
Filed on Dec. 1, 2020, as Appl. No. 17/108,567.
Prior Publication US 2022/0173539 A1, Jun. 2, 2022
Int. Cl. H01R 12/85 (2011.01); H01R 4/01 (2006.01); H05K 3/32 (2006.01)
CPC H01R 12/856 (2013.01) [H01R 4/01 (2013.01); H05K 3/325 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A device comprising:
first and second clamping portions pivotally coupled to each other, wherein at least one of the first and second clamping portions comprises a plurality of interconnect contacts to contact a plurality of board contacts of an insertable circuit board, wherein the first and second clamping portions are pivotally spaced away from each other to allow insertion of the insertable circuit board therebetween in an open position, wherein the first and second clamping portions are pivotally spaced closer to each other than when in the open position to contact both sides of the insertable circuit board positioned therebetween in a closed position;
one or more springs to bias first and second clamping portions into the closed position;
an actuator operably coupling the first and second clamping portions to pivotally move the first and second clamping portions into the open position; and
a controller comprising one or more processors operably coupled to the actuator to selectively pivotally move the first and second clamping portions into the open position.