US 12,113,293 B2
Antenna-on-package including multiple types of antenna
Yiqi Tang, Allen, TX (US); and Rajen Manicon Murugan, Dallas, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Feb. 15, 2023, as Appl. No. 18/169,682.
Application 18/169,682 is a continuation of application No. 17/232,849, filed on Apr. 16, 2021, granted, now 11,600,932.
Claims priority of provisional application 63/011,301, filed on Apr. 17, 2020.
Prior Publication US 2023/0198170 A1, Jun. 22, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 23/00 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01)
CPC H01Q 23/00 (2013.01) [H01L 23/66 (2013.01); H01Q 1/2283 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An antenna in package (AIP), comprising:
a plurality of metal pillars including a first metal pillar electrically coupled between a first contact pad and a first antenna and a second metal pillar electrically coupled between a second contact pad and a second antenna, the first antenna and the second antenna collectively include at least two of a patch antenna, a horn antenna, a bow-tie antenna, and a Vivaldi antenna; and
wherein at least a first of a plurality of filled vias is electrically coupled to the first metal pillar for providing a first transmission line from the first contact pad to the first antenna, and wherein at least a second of the plurality of filled vias is electrically coupled to the second metal pillar for providing a second transmission line from the second contact pad to the second antenna.