US 12,113,285 B2
Feed patches for multi-layer dielectric resonator antennas
Subramanian Ramalingam, Cupertino, CA (US); David Garrido Lopez, San Jose, CA (US); Forhad Hasnat, Milpitas, CA (US); Harish Rajagopalan, San Jose, CA (US); and Panagiotis Theofanopoulos, Cupertino, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Sep. 23, 2022, as Appl. No. 17/951,877.
Prior Publication US 2024/0106134 A1, Mar. 28, 2024
Int. Cl. H01Q 21/06 (2006.01); H01Q 9/04 (2006.01)
CPC H01Q 21/065 (2013.01) [H01Q 9/0414 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing;
a dielectric cover layer on the housing;
a printed circuit;
a first dielectric resonating element mounted to the printed circuit;
a second dielectric resonating element mounted to the first dielectric resonating element;
a feed probe configured to excite the first and second dielectric resonating elements to convey radio-frequency signals through the dielectric cover layer, the feed probe comprising:
a conductive via extending through the first dielectric resonating element, and
a conductive patch that is disposed between the first dielectric resonating element and the second dielectric resonating element and that is coupled to the conductive via; and
a dielectric layer interposed between the dielectric cover layer and the second dielectric resonating element.