US 12,113,267 B2
Antenna assembly for a vehicle
Larry Greenstein, San Diego, CA (US); and Joe L. Romack, Scottsdale, AZ (US)
Assigned to Airgain, Inc., San Diego, CA (US)
Filed by Airgain, Inc., San Diego, CA (US)
Filed on May 24, 2023, as Appl. No. 18/201,526.
Application 18/201,526 is a continuation of application No. 17/390,080, filed on Jul. 30, 2021, granted, now 11,664,573.
Application 17/390,080 is a continuation of application No. 16/847,981, filed on Apr. 14, 2020, granted, now 11,165,132, issued on Nov. 2, 2021.
Application 16/847,981 is a continuation in part of application No. 16/570,448, filed on Sep. 13, 2019, granted, now 10,931,325, issued on Feb. 23, 2021.
Application 16/570,448 is a continuation in part of application No. 16/237,678, filed on Jan. 1, 2019, granted, now 10,511,086, issued on Dec. 17, 2019.
Prior Publication US 2023/0299457 A1, Sep. 21, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01); H01Q 1/02 (2006.01); H01Q 1/32 (2006.01); H01Q 1/42 (2006.01)
CPC H01Q 1/02 (2013.01) [H01Q 1/3275 (2013.01); H01Q 1/42 (2013.01); H05K 7/20481 (2013.01); H05K 7/20509 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A heat dissipation system for an antenna assembly for a vehicle, the antenna assembly having a modem that generates heat during operation and an amplifier, the heat dissipation system comprising:
a base comprising a sidewall, a component mounting surface and a heat sink, the heat sink comprising a plurality of heat dissipation elements; and
a first heat transfer plate in thermal contact with the modem;
a second heat transfer plate mounted on the amplifier;
wherein the modem is disposed on the component mounting surface;
wherein the first heat transfer plate is in thermal contact with a first area of the heat sink;
wherein the second heat transfer plate is in thermal contact with a second area of the heat sink;
wherein the first area of the heat sink is located on one side of the base, the second area of the heat sink is located on an opposing side of the base, and a third area of the heat sink is located at a rear section of the base.