US 12,113,264 B2
Fabrication of surface mount microstrip circulators using a ferrite and ceramic dielectric assembly substrate
Iain Alexander Macfarlane, Insch (GB); Scott David Wilson, Cork (IE); David Bowie Cruickshank, Rockville, MD (US); and Michael David Hill, Emmitsburg, MD (US)
Assigned to SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed by SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed on Oct. 25, 2023, as Appl. No. 18/494,036.
Application 18/494,036 is a division of application No. 17/540,522, filed on Dec. 2, 2021, granted, now 11,843,152.
Claims priority of provisional application 63/121,585, filed on Dec. 4, 2020.
Prior Publication US 2024/0079753 A1, Mar. 7, 2024
Int. Cl. H04B 1/40 (2015.01); H01P 1/38 (2006.01); H01P 11/00 (2006.01); H03F 3/24 (2006.01)
CPC H01P 1/38 (2013.01) [H03F 3/245 (2013.01); H04B 1/40 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming an integrated microstrip circulator, the method comprising:
translating a ferrite disc into an aperture in a dielectric substrate;
securing the ferrite disc in the dielectric substrate with an adhesive to form a composite structure; and
forming circuitry on an upper surface of the composite structure and forming surface mount contacts on a lower surface of the composite structure by metallizing the upper and lower surfaces of the composite structure.