US 12,113,140 B2
Method of manufacturing an integrated component with improved spatial occupation, and integrated component
Luca Seghizzi, Milan (IT); Linda Montagna, Torre d'Isola (IT); Giuseppe Visalli, Gorgonzola (IT); and Mikel Azpeitia Urquia, Milan (IT)
Assigned to STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed on Feb. 10, 2022, as Appl. No. 17/668,739.
Application 17/668,739 is a division of application No. 16/744,865, filed on Jan. 16, 2020, granted, now 11,276,789.
Claims priority of application No. 102019000000917 (IT), filed on Jan. 22, 2019.
Prior Publication US 2022/0165892 A1, May 26, 2022
Int. Cl. H01L 31/0232 (2014.01); G02B 26/08 (2006.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01L 31/113 (2006.01); H02N 1/00 (2006.01)
CPC H01L 31/02325 (2013.01) [G02B 26/0841 (2013.01); H01L 31/02005 (2013.01); H01L 31/0203 (2013.01); H01L 31/1136 (2013.01); H02N 1/004 (2013.01)] 19 Claims
OG exemplary drawing
 
12. An integrated component, comprising:
a first wafer having first and second trenches defined in a top surface thereof; and
a second wafer formed by a substrate and a structural layer on the substrate, the structural layer integrating an electromagnetic radiation detector overlying the second trench, the second wafer being coupled to the first wafer;
a first cap coupled to the second wafer in a position overlying the electromagnetic radiation detector and serving to cooperate with the second wafer to define a first air-tight chamber for the electromagnetic radiation detector;
a stator, a rotor, and a mobile mass integrated in the substrate of the second wafer, the stator and rotor forming a drive assembly for driving the mobile mass, the rotor overlying the first trench; and
a second cap coupled to the second wafer in a position overlying the mobile mass and serving to cooperate with the second wafer to define a second air-tight chamber for the mobile mass.