US 12,113,082 B2
Sensor package structure
Ya-Han Chang, Hsin-Chu County (TW); Li-Chun Hung, Hsin-Chu County (TW); and Chien-Chen Lee, Hsin-Chu County (TW)
Assigned to TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei (TW)
Filed by KINGPAK TECHNOLOGY INC., Hsin-Chu County (TW)
Filed on Apr. 11, 2022, as Appl. No. 17/717,223.
Claims priority of application No. 110149017 (TW), filed on Dec. 28, 2021.
Prior Publication US 2023/0207590 A1, Jun. 29, 2023
Int. Cl. H01L 27/146 (2006.01); H01L 23/00 (2006.01)
CPC H01L 27/14621 (2013.01) [H01L 24/05 (2013.01); H01L 24/48 (2013.01); H01L 27/14618 (2013.01); H01L 27/14627 (2013.01); H01L 2224/05026 (2013.01); H01L 2224/48228 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A sensor package structure, comprising:
a substrate;
a sensor chip disposed on and electrically coupled to the substrate, wherein a top portion of the sensor chip defines a sensing region and a carrying region that surrounds the sensing region, and wherein the top portion of the sensor chip includes:
a passivation layer arranged in the sensing region and the carrying region;
a color filter layer including a central segment arranged in the sensing region and a peripheral segment that is arranged in the carrying region and that has a roughened surface;
a pixel layer arranged in the sensing region and formed on the central segment; and
a micro-lens layer arranged in the sensing region and formed on the pixel layer;
a ring-shaped support formed on the carrying region of the sensor chip, wherein at least part of the peripheral segment of the color filter layer is embedded in the ring-shaped support; and
a light-permeable layer disposed on the ring-shaped support, wherein the light-permeable layer, the ring-shaped support, and the sensor chip jointly define an enclosed space.