	US 12,113,043 B2
	Methods of calibrating an ultrasonic characteristic on a wire bonding system
Jon W. Brunner, Fort Washington, PA (US); Wei Qin, Fort Washington, PA (US); Aashish Shah, Fort Washington, PA (US); Hui Xu, Fort Washington, PA (US); and Jeong Ho Yang, Fort Washington, PA (US)
Assigned to Kulicke and Soffa Industries, Inc., Fort Washington, PA (US)
Filed by Kulicke and Soffa Industries, Inc., Fort Washington, PA (US)
Filed on Nov. 15, 2022, as Appl. No. 17/987,708.
Claims priority of provisional application 63/280,107, filed on Nov. 16, 2021.
Prior Publication US 2023/0154888 A1, May 18, 2023
Int. Cl. B23K 20/00 (2006.01); B23K 20/10 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01)

CPC H01L 24/78 (2013.01) [B23K 20/10 (2013.01); B23K 2101/40 (2018.08); H01L 2224/78001 (2013.01); H01L 2224/78343 (2013.01); H01L 2224/78901 (2013.01); H01L 2924/386 (2013.01)]

22 Claims

1. A method of calibrating an ultrasonic characteristic on a wire bonding system, the method comprising the steps of:

(a) determining a reference ultrasonic characteristic for formation of a wire bond;

(b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition_by incrementally adjusting an applied ultrasonic characteristic in wire bonding operations until the non-stick wire bond condition results, wherein the non-stick wire bond condition occurs when a predetermined percentage of wire bonds tested at the applied ultrasonic characteristic do not stick to their respective bonding location;

(c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and

(d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.