US 12,113,030 B2
Electronic component module comprising shield and sealing resin covering electronic components
Tadashi Nomura, Nagaokakyo (JP); and Yoshihito Otsubo, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto-fu (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Mar. 18, 2022, as Appl. No. 17/655,376.
Application 17/655,376 is a continuation of application No. PCT/JP2020/035348, filed on Sep. 17, 2020.
Claims priority of application No. 2019-177512 (JP), filed on Sep. 27, 2019.
Prior Publication US 2022/0208690 A1, Jun. 30, 2022
Int. Cl. H01L 23/552 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01); H01L 25/18 (2023.01); H01Q 1/38 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01Q 1/38 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic component module comprising:
a module substrate including a first surface, a second surface located opposite to the first surface, and a peripheral side surface connecting the first surface and the second surface to each other, electronic components being mounted on each of the first surface and the second surface;
a sealing resin portion provided on at least one of the first surface and the second surface, the electronic component being sealed with the sealing resin portion; and
a shield provided to cover each of the sealing resin portion and the peripheral side surface, wherein
the module substrate is provided with a ground electrode,
the shield is connected to the ground electrode, and
a recess is located along the peripheral side surface, such that the shield is separated into a first surface side and a second surface side.