US 12,113,013 B2
Dual color via patterning
Hsueh-Chung Chen, Cohoes, NY (US); Yann Mignot, Slingerlands, NY (US); Su Chen Fan, Cohoes, NY (US); Mary Claire Silvestre, Clifton Park, NY (US); Chi-Chun Liu, Altamont, NY (US); and Junli Wang, Slingerlands, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Sep. 24, 2021, as Appl. No. 17/483,922.
Prior Publication US 2023/0100368 A1, Mar. 30, 2023
Int. Cl. H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01)
CPC H01L 23/5226 (2013.01) [H01L 21/76807 (2013.01); H01L 21/76883 (2013.01); H01L 23/53228 (2013.01); H01L 23/53257 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a first dielectric material;
a first metal line in the first dielectric material;
a second dielectric material disposed on the first dielectric material and the first metal line;
a second metal line in the second dielectric material, wherein the first metal line and the second metal line have angled sidewalls; and
a plurality of metal vias disposed on a same level and connecting the first metal line and the second metal line, wherein the plurality of metal vias comprise a first top via and a bottom via having different sidewall profile angles.