| CPC H01L 23/49822 (2013.01) [H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 24/32 (2013.01); H01L 25/105 (2013.01); H01L 2224/32145 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/107 (2013.01)] | 10 Claims |
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1. An electronic package, comprising:
a circuit structure;
an electronic element disposed on and electrically connected to the circuit structure;
a plurality of first conductive elements disposed on and electrically connected to the circuit structure;
a first packaging layer formed on the circuit structure to cover the electronic element and the plurality of conductive elements; and
a packaging module disposed on the first packaging layer, wherein the packaging module includes a routing structure, a plurality of second conductive elements disposed on and electrically connected to the routing structure, and a second packaging layer formed on the routing structure to cover the plurality of second conductive elements, wherein the packaging module is disposed on the first packaging layer via the second packaging layer thereof, such that the routing structure is overlapped on the circuit structure, and wherein each of the second conductive elements is correspondingly and directly bonded with and electrically connected to each of the first conductive elements.
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