US 12,112,971 B2
Multi-zone semiconductor substrate supports
Ian Bensco, Mountain View, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 12, 2021, as Appl. No. 17/200,080.
Prior Publication US 2022/0293453 A1, Sep. 15, 2022
Int. Cl. H01L 21/687 (2006.01)
CPC H01L 21/68785 (2013.01) [H01L 21/68735 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A substrate support assembly comprising:
a top puck characterized by a first surface and a second surface opposite the first surface, wherein the top puck defines a recessed ledge at an outer edge of the first surface of the top puck;
a cooling plate coupled with the top puck adjacent the second surface of the top puck;
a back plate coupled with the top puck about an exterior of the top puck, wherein the back plate at least partially defines a volume with the top puck, and wherein the cooling plate is housed within the volume;
a heater disposed on the recessed ledge of the top puck, wherein:
the heater defines an interior volume within which a heating element extends; and
the heating element extends through the top puck into the heater; and
an edge ring seated on the heater and extending about the top puck, wherein the edge ring is maintained free of contact with the top puck.