US 12,112,970 B2
Substrate transfer apparatus
Daeho Min, Seoul (KR); Junhyung Kim, Yongin-si (KR); Minsoo Han, Suwon-si (KR); Mngu Lee, Cheonan-si (KR); and Minwoo Rhee, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 30, 2021, as Appl. No. 17/460,424.
Claims priority of application No. 10-2020-0163816 (KR), filed on Nov. 30, 2020.
Prior Publication US 2022/0172977 A1, Jun. 2, 2022
Int. Cl. H01L 21/683 (2006.01); B25J 15/06 (2006.01); B65G 47/91 (2006.01)
CPC H01L 21/6838 (2013.01) [B25J 15/0683 (2013.01); B65G 47/91 (2013.01); B65G 2249/045 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate transfer apparatus comprising:
a body portion having a surface including a rectangular and flat holding region corresponding in shape to a substrate to be transferred, wherein the body portion is movable relative to the substrate such that the surface approaches the substrate up to at least a first distance;
vacuum holes distributed in the holding region and forming negative pressure to provide suction force to the substrate disposed at the first distance, wherein at least some of the vacuum holes are disposed at equal intervals in the holding region and have the same width; and
air holes distributed in the holding region and forming positive pressure to provide a buoyancy force to the substrate close to the holding region at a second distance smaller than the first distance.