US 12,112,962 B2
Arrangement apparatus and arrangement method
Kohei Seyama, Tokyo (JP)
Assigned to SHINKAWA LTD., Tokyo (JP)
Appl. No. 17/599,535
Filed by SHINKAWA LTD., Tokyo (JP)
PCT Filed Aug. 20, 2020, PCT No. PCT/JP2020/031466
§ 371(c)(1), (2) Date Sep. 28, 2021,
PCT Pub. No. WO2022/038745, PCT Pub. Date Feb. 24, 2022.
Prior Publication US 2022/0319885 A1, Oct. 6, 2022
Int. Cl. H01L 21/67 (2006.01); G03F 7/00 (2006.01); H01L 21/02 (2006.01); H01L 21/60 (2006.01); H01L 21/68 (2006.01)
CPC H01L 21/67259 (2013.01) [G03F 7/70433 (2013.01); G03F 7/70691 (2013.01); H01L 21/02 (2013.01); H01L 21/60 (2021.08); H01L 21/681 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An arrangement apparatus which arranges a plurality of dies on a substrate in correspondence with a plurality of patterns so as to bond to a wafer having the patterns formed by an exposure apparatus, the arrangement apparatus comprising:
a stage which supports the substrate;
an arrangement part which holds the die and arranges the dies on the substrate supported by the stage; and
a control part which has a map data indicating arrangement positions of the dies and generated based on a positional relationship among the patterns formed by the exposure apparatus, and controls, based on the map data, relative positions between the stage and the arrangement part when arranging the dies on the substrate.