US 12,112,924 B2
Composite structure and semiconductor manufacturing apparatus including composite structure
Hiroaki Ashizawa, Kitakyushu (JP); and Ryoto Takizawa, Kitakyushu (JP)
Assigned to Toto Ltd., Fukuoka (JP)
Filed by TOTO LTD., Kitakyushu (JP)
Filed on Apr. 29, 2021, as Appl. No. 17/244,299.
Claims priority of application No. 2020-080287 (JP), filed on Apr. 30, 2020; application No. 2020-080289 (JP), filed on Apr. 30, 2020; and application No. 2021-045300 (JP), filed on Mar. 18, 2021.
Prior Publication US 2021/0343511 A1, Nov. 4, 2021
Int. Cl. H01J 37/32 (2006.01); H01L 21/67 (2006.01)
CPC H01J 37/32504 (2013.01) [H01J 37/32495 (2013.01); H01L 21/67069 (2013.01); H01J 37/321 (2013.01); H01J 2237/3341 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A composite structure comprising: a base material; and a structure that is provided on the base material and has a surface,
wherein the structure comprises Y3Al5O12 as a main component, and the Y3Al5O12 has a lattice constant a, calculated by the following formula (1) being larger than 12.080 Å:
a=d·(h2+k2+l2)1/2  (1)
where d represents a lattice plane spacing, and (hkl) represents a Miller index.