US 12,112,922 B2
Plasma treatment apparatus
Kentaro Kiyosue, Tokyo (JP); Kohei Sato, Tokyo (JP); Ryoichi Isomura, Tokyo (JP); Koji Nagai, Tokyo (JP); and Tsutomu Matsuyoshi, Tokyo (JP)
Assigned to HITACHI HIGH-TECH CORPORATION, Tokyo (JP)
Appl. No. 17/641,886
Filed by Hitachi High-Tech Corporation, Tokyo (JP)
PCT Filed May 27, 2021, PCT No. PCT/JP2021/020226
§ 371(c)(1), (2) Date Dec. 1, 2022,
PCT Pub. No. WO2022/249398, PCT Pub. Date Dec. 1, 2022.
Prior Publication US 2024/0047179 A1, Feb. 8, 2024
Int. Cl. H01J 37/32 (2006.01); H05H 1/46 (2006.01)
CPC H01J 37/32449 (2013.01) 9 Claims
OG exemplary drawing
 
1. A plasma treatment apparatus comprising a treatment chamber and a gas supply device for supplying a treatment gas into the treatment chamber,
the gas supply device comprising:
a mass flow controller box having an intake port and an exhaust port;
a plurality of first pipes which are located in the mass flow controller box and to each of which a mass flow controller is attached; and
a plurality of second pipes which are connected to the plurality of first pipes in the mass flow controller box and connected to a plurality of third pipes as supply sources of the treatment gas by a plurality of first joints outside the mass flow controller box, wherein
at least one of the first joints is covered by a first pipe cover so that the first joint is hermetically sealed, and
an inside of the first pipe cover and an inside of the mass flow controller box are communicated by a first communicating member.