CPC H01G 4/224 (2013.01) [H01G 4/2325 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01)] | 30 Claims |
1. A multilayer electronic component comprising:
a body including a dielectric layer and a first internal electrode and a second internal electrode alternately disposed with the dielectric layer interposed therebetween, the body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface;
a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface;
an insulating layer disposed on the second surface and extending onto the first and second connection portions;
a first plating layer disposed on the first band portion; and
a second plating layer disposed on the second band portion,
wherein the insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.
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