US 12,112,222 B2
Shielding and/or enhancement of temperature-sensing RFID devices
Ian J. Forster, Chelmsford (GB)
Assigned to Avery Dennison Retail Information Services LLC, Mentor, OH (US)
Filed by Avery Dennison Retail Information Services LLC, Mentor, OH (US)
Filed on Aug. 8, 2023, as Appl. No. 18/366,862.
Application 18/366,862 is a division of application No. 16/706,012, filed on Dec. 6, 2019, granted, now 11,783,154.
Claims priority of provisional application 62/776,254, filed on Dec. 6, 2018.
Prior Publication US 2023/0376720 A1, Nov. 23, 2023
Int. Cl. G06K 19/077 (2006.01); G06K 19/07 (2006.01)
CPC G06K 19/0773 (2013.01) [G06K 19/0723 (2013.01); G06K 19/07775 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A temperature-sensing RFID device, comprising:
an RFID chip including a temperature sensor;
an antenna adapted to receive energy from an RF field and produce a signal and including
a first portion directly coupled to the RFID chip, the first portion of the antenna comprising a minor portion sized and configured to minimize heat transfer from the antenna to the RFID chip and
a second portion separated from the RFID chip and from the first portion of the antenna by a thermally isolating gap and configured to be coupled to the RFID chip by a magnetic field, an electric field, or both a magnetic field and an electric field, the second portion of the antenna comprising a major portion that is larger than the first portion of the antenna.