US 12,112,221 B2
Shielding and/or enhancement of temperature-sensing RFID devices
Ian J. Forster, Chelmsford (GB)
Assigned to Avery Dennison Retail Information Services LLC, Mentor, OH (US)
Filed by Avery Dennison Retail Information Services LLC, Mentor, OH (US)
Filed on Aug. 8, 2023, as Appl. No. 18/366,852.
Application 18/366,852 is a division of application No. 16/706,012, filed on Dec. 6, 2019, granted, now 11,783,154.
Claims priority of provisional application 62/776,254, filed on Dec. 6, 2018.
Prior Publication US 2024/0020508 A1, Jan. 18, 2024
Int. Cl. G06K 19/077 (2006.01); G06K 19/07 (2006.01)
CPC G06K 19/0773 (2013.01) [G06K 19/0723 (2013.01); G06K 19/07775 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A temperature-sensing RFID device, comprising:
an RFID chip including a temperature sensor;
an antenna electrically coupled to the RFID chip and adapted to receive energy from an RF field and produce a signal; and
a thermally conductive or absorbent structure associated with the RFID chip, oriented so as to be positioned between at least a portion of the RFID chip and an article to which the temperature-sensing RFID device is to be secured, and configured to enhance thermal coupling between the temperature sensor and said article, wherein the thermally conductive structure includes a portion of the antenna in direct contact with at least a portion of the RFID chip and configured to be in direct contact with said article.