US 12,111,986 B2
Waterproof electronic pen
Takayuki Arai, Saitama (JP); Kenichi Ninomiya, Saitama (JP); and Takenori Kaneda, Saitama (JP)
Assigned to Wacom Co., Ltd., Saitama (JP)
Filed by Wacom Co., Ltd., Saitama (JP)
Filed on Nov. 14, 2023, as Appl. No. 18/509,103.
Application 18/509,103 is a continuation of application No. 17/133,057, filed on Dec. 23, 2020, granted, now 11,853,484.
Application 17/133,057 is a continuation of application No. PCT/JP2019/018321, filed on May 8, 2019.
Claims priority of application No. 2018-136994 (JP), filed on Jul. 20, 2018.
Prior Publication US 2024/0085997 A1, Mar. 14, 2024
Int. Cl. G06F 3/0354 (2013.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01)
CPC G06F 3/03545 (2013.01) [H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 2203/1316 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A waterproof electronic pen that transmits a position indication signal, the waterproof electronic pen comprising:
a board housing including a recessed portion having an opening over a lower surface of the recessed portion;
a circuit board;
a board holder disposed in the board housing, the board holder being configured to hold the circuit board in the recessed portion of the board housing;
a plurality of circuit components including first components arranged on a first surface of the circuit board, and a press switch and a capacitor arranged on a second surface of the circuit board,
wherein the first components arranged on the first surface of the circuit board include a battery,
wherein the first surface faces the lower surface of the recessed portion of the board housing,
wherein the lower surface of the recessed portion of the board housing includes a plurality of projected portions that fill a space between the circuit board and the lower surface of the recessed portion of the board housing provided according to the circuit components arranged on the first surface of the circuit board and form recessed and projected areas, and
wherein at least one of the projected portions extends from the lower surface of the recessed portion of the board housing to the circuit board; and
a thermosetting resin formed over the second surface of the circuit board that seals the opening over the lower surface of the recessed portion of the board housing.