US 12,111,783 B2
Flexible on-die fabric interface
Swadesh Choudhary, Mountain View, CA (US); Robert G. Blankenship, Tacoma, WA (US); Siva Prasad Gadey, Portland, OR (US); Sailesh Kumar, Los Altos, CA (US); Vinit Mathew Abraham, Hillsboro, OR (US); and Yen-Cheng Liu, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jul. 7, 2023, as Appl. No. 18/349,055.
Application 18/349,055 is a continuation of application No. 16/914,327, filed on Jun. 27, 2020, granted, now 11,698,879.
Claims priority of provisional application 62/944,773, filed on Dec. 6, 2019.
Prior Publication US 2023/0350829 A1, Nov. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 13/40 (2006.01)
CPC G06F 13/4027 (2013.01) 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a controller comprising:
first protocol circuitry to implement one or more layers of a load/store protocol;
second protocol circuitry to implement one or more layers of at least one of a CXL.mem protocol or a CXL.cache protocol;
first interface circuitry to implement a first interface to couple the first protocol circuitry to a fabric;
second interface circuitry to implement a different, second interface to couple the second protocol circuitry to the fabric, wherein the second interface comprises:
a global channel to use a first set of wires, wherein the global channel is to carry signals for initialization of the interface;
a request channel to use a second set of wires, wherein the request channel is to carry requests to the fabric;
a response channel to use a third set of wires, wherein the response channel is to carry responses to the fabric; and
a data channel to use a fourth set of wires, wherein the data channel is to carry data transfers to the fabric.