US 12,111,776 B2
Multi-dimensional memory cluster
Byung Hee Choi, Fremont, CA (US)
Assigned to Samsung Electronics Co., Ltd., Yongin-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 16, 2021, as Appl. No. 17/553,393.
Claims priority of provisional application 63/274,381, filed on Nov. 1, 2021.
Prior Publication US 2023/0139732 A1, May 4, 2023
Int. Cl. G06F 13/16 (2006.01); G06F 11/07 (2006.01)
CPC G06F 13/1668 (2013.01) [G06F 11/0727 (2013.01); G06F 11/0751 (2013.01); G06F 11/0793 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a first node, having an external port for making a connection to a host;
a second node, connected to the first node by a first memory-centric connection;
the second node storing a service level descriptor;
the first node being configured to:
receive, from the host, a first request, addressed to the second node, for the service level descriptor; and
forward the first request to the second node,
the second node being configured to:
receive the first request; and
send a first response to the host via the first node, the first response including the service level descriptor of the second node.