US 12,111,711 B2
Method, apparatus, and system for energy efficiency and energy conservation including power and performance balancing between multiple processing elements and/or a communication bus
Travis T. Schluessler, Berthoud, CO (US); and Russell J. Fenger, Beaverton, OR (US)
Assigned to Daedalus Prime LLC, Bronxville, NY (US)
Filed by Daedalus Prime LLC, Bronxville, NY (US)
Filed on Aug. 16, 2021, as Appl. No. 17/402,927.
Application 17/402,927 is a continuation of application No. 16/421,647, filed on May 24, 2019, granted, now 11,106,262.
Application 16/421,647 is a continuation of application No. 15/611,876, filed on Jun. 2, 2017, granted, now 10,317,976, issued on Jun. 11, 2019.
Application 15/611,876 is a continuation of application No. 14/526,040, filed on Oct. 28, 2014, granted, now 9,703,352, issued on Jul. 11, 2017.
Application 14/526,040 is a continuation of application No. 13/398,641, filed on Feb. 16, 2012, granted, now 8,898,494, issued on Nov. 25, 2014.
Application 13/398,641 is a continuation in part of application No. 13/327,670, filed on Dec. 15, 2011, granted, now 9,304,570, issued on Apr. 5, 2016.
Prior Publication US 2021/0373638 A1, Dec. 2, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 1/32 (2019.01); G06F 1/20 (2006.01); G06F 1/3203 (2019.01); G06F 1/3206 (2019.01); G06F 1/3234 (2019.01); G06F 1/3287 (2019.01); G06F 1/329 (2019.01); G06F 9/50 (2006.01)
CPC G06F 1/3206 (2013.01) [G06F 1/206 (2013.01); G06F 1/3203 (2013.01); G06F 1/3253 (2013.01); G06F 1/3287 (2013.01); G06F 1/329 (2013.01); G06F 9/5094 (2013.01); G06F 9/50 (2013.01); Y02D 10/00 (2018.01)] 8 Claims
OG exemplary drawing
 
1. A system on chip (SoC) comprising:
an integrated circuit package comprising:
a core unit having a first core to support out-of-order execution of instructions, including a first cache memory, a second core to support in-order execution of instructions including a second cache memory, and a shared cache memory to be shared by at least the first core and the second core;
a graphics processing unit (GPU) to execute a graphics workload;
a memory controller;
a communication bus coupled to the core unit, the communication bus to couple the core unit and the GPU, the communication bus comprising a cache coherent interconnect;
a static random access memory;
an interface to interface the SoC with another device via a Peripheral Component Interconnect Express (PCIE) protocol;
a first workload monitor to determine a core workload of the core unit;
a second workload monitor to determine the graphics workload of the GPU;
a third workload monitor to determine a bus workload for the communication bus; and
a power controller to reduce a power consumption of at least the core unit if a thermal value of the SoC exceeds a thermal design power (TDP) limit for the SoC, wherein in a first scenario the power controller is to increase a frequency for the GPU when the graphics workload is greater than a graphics threshold and reduce the frequency of the core unit, and in a second scenario to increase a frequency for the core unit and the communication bus and reduce the frequency of the GPU,
wherein the power controller is to receive the bus workload and to dynamically balance power between the core unit and the communication bus based on the TDP limit and a comparison between the bus workload and a bus threshold, and
wherein the power controller, in response to operation of the SoC at the TDP limit, is to increase frequency for the communication bus and cap the frequency for the core unit if the bus workload is greater than the bus threshold, and decrease the frequency for the communication bus and increase the frequency for the core unit if the bus workload is less than the bus threshold.