US 12,111,688 B2
Electronic device including housing and manufacturing method thereof
Byounghee Choi, Gyeonggi-do (KR); Sunghoon Kim, Gyeonggi-do (KR); Sungjin Park, Gyeonggi-do (KR); Jinho Lee, Gyeonggi-do (KR); Youngsoo Jang, Gyeonggi-do (KR); Sanggyou Choi, Gyeonggi-do (KR); and Yongwook Hwang, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Mar. 17, 2022, as Appl. No. 17/697,170.
Application 17/697,170 is a continuation of application No. PCT/KR2022/003753, filed on Mar. 17, 2022.
Claims priority of application No. 10-2021-0034691 (KR), filed on Mar. 17, 2021.
Prior Publication US 2022/0300034 A1, Sep. 22, 2022
Int. Cl. G06F 1/16 (2006.01)
CPC G06F 1/1626 (2013.01) [G06F 1/1656 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing comprising a first surface including a first surface roughness;
a second surface extended from the first surface and including a second surface roughness different from the first surface roughness;
an oxide film layer having a first film portion disposed on the first surface and a second film portion extended from the first film portion is disposed on the second surface;
the first film portion and the second film portion having a substantially uniform thickness, and a substantially uniform roughness; and
an end section of the first film portion and an end section of the second film portion facing the first film portion formed at the same position.