US 12,111,582 B2
Substrate stage and substrate processing system using the same
Yu-Huan Chen, Hsinchu (TW); Yu-Chih Huang, Hsinchu (TW); Ya-An Peng, Taoyuan (TW); Shang-Chieh Chien, New Taipei (TW); Li-Jui Chen, Hsinchu (TW); and Heng-Hsin Liu, New Taipei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 13, 2023, as Appl. No. 18/351,571.
Application 18/351,571 is a continuation of application No. 17/370,267, filed on Jul. 8, 2021, granted, now 11,747,741.
Claims priority of provisional application 63/156,969, filed on Mar. 5, 2021.
Prior Publication US 2023/0359133 A1, Nov. 9, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 7/00 (2006.01)
CPC G03F 7/70725 (2013.01) [G03F 7/70758 (2013.01); G03F 7/70775 (2013.01); G03F 7/70358 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor substrate stage for carrying a substrate, comprising:
a base layer;
a magnetic shielding layer disposed on the base layer;
a carrier layer disposed on the magnetic shielding layer;
a receiver disposed on the carrier layer;
a storage layer disposed between the base layer and the magnetic shielding layer; and
a magnetic shielding element disposed on the carrier layer and surrounding the receiver.