US 12,111,567 B2
Method for performing optical proximity correction and method of manufacturing a mask using optical proximity correction
Na-rak Choi, Yongin-si (KR); and Moon-gyu Jeong, Gwangmyeong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Apr. 19, 2019, as Appl. No. 16/389,536.
Claims priority of application No. 10-2018-0106508 (KR), filed on Sep. 6, 2018.
Prior Publication US 2020/0081336 A1, Mar. 12, 2020
Int. Cl. G03F 1/36 (2012.01); G06F 30/20 (2020.01)
CPC G03F 1/36 (2013.01) [G06F 30/20 (2020.01)] 8 Claims
OG exemplary drawing
 
1. A method for performing optical proximity correction (OPC) comprising:
extracting edges for a layout of a pattern on a mask;
extracting edge pairs for the layout of the pattern on the mask itself in which widths between adjacent edges among the edges are equal to or less than a certain distance;
generating a coupling edge for each of the edge pairs;
generating a first mask image by applying an edge filter to the edges; and
correcting the first mask image by applying a coupling filter to the coupling edge,
wherein edge filter corresponds to a first difference image obtained by subtracting a thin mask image obtained through a thin mask approximation from a rigorous mask image obtained through an electromagnetic field simulation in an edge portion of a pattern comprising the edge pairs, and
wherein the coupling filter corresponds to a second difference image obtained by subtracting the first difference image and the thin mask image from the rigorous mask image for the mask pattern.