US 12,111,504 B2
Alignment method for optical waveguide element
Hiroshi Ishikawa, Tokyo (JP); Makoto Abe, Tokyo (JP); Norio Sato, Tokyo (JP); and Atsushi Aratake, Tokyo (JP)
Assigned to Nippon Telegraph and Telephone Corporation, Tokyo (JP)
Appl. No. 17/627,743
Filed by Nippon Telegraph and Telephone Corporation, Tokyo (JP)
PCT Filed Jul. 18, 2019, PCT No. PCT/JP2019/028296
§ 371(c)(1), (2) Date Jan. 17, 2022,
PCT Pub. No. WO2021/009911, PCT Pub. Date Jan. 21, 2021.
Prior Publication US 2022/0317387 A1, Oct. 6, 2022
Int. Cl. G02B 6/42 (2006.01); G02B 6/122 (2006.01)
CPC G02B 6/4204 (2013.01) [G02B 6/122 (2013.01); G02B 6/422 (2013.01); G02B 6/4239 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optical waveguide alignment method comprising:
covering each of end portions of at least two optical waveguide elements and at least one spatial optical element with a bonding material in a semi-solid state, the at least one spatial optical element being disposed between incidence and emission end faces of the end portions of the at least two optical waveguide elements;
causing light for alignment to be incident on at least one of the at least two optical waveguide elements so that light enters a portion of the bonding material between the at least two optical waveguide elements; and
changing the bonding material into a solid state after the at least one spatial optical element moves onto an optical path between the incidence and emission end faces of the at least two optical waveguide elements due to radiation pressure of light acting on the at least one spatial optical element,
wherein the at least two optical waveguide elements are optically connected via the bonding material and the at least one spatial optical element, and each of the at least two optical waveguide elements and the at least one spatial optical element are mechanically connected by the bonding material.