US 12,111,497 B2
Applying stress compensation for aligning a companion chip with a host chip
Raphael Beaupré-Laflamme, Quebec (CA); and Simon Savard, Quebec (CA)
Assigned to Ciena Corporation, Hanover, MD (US)
Filed by Ciena Corporation, Hanover, MD (US)
Filed on Jun. 7, 2023, as Appl. No. 18/330,414.
Application 18/330,414 is a division of application No. 17/015,549, filed on Sep. 9, 2020, granted, now 11,846,806.
Prior Publication US 2023/0314712 A1, Oct. 5, 2023
Int. Cl. H05K 3/30 (2006.01); B25J 15/00 (2006.01); B25J 15/06 (2006.01); G02B 6/13 (2006.01); H01L 23/00 (2006.01)
CPC G02B 6/13 (2013.01) [B25J 15/0028 (2013.01); B25J 15/0616 (2013.01); H01L 24/83 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/83855 (2013.01); H01L 2924/3511 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method for applying stress compensation for aligning a companion chip with a host chip, the method comprising:
performing an active alignment to finely align the companion chip with the host chip by
receiving a feedback from the host chip on whether the companion chip is optically aligned with the host chip, and
activating a pick-up tool to apply a stress compensation force to the companion chip to adjust a curvature of the companion chip until the companion chip is optically aligned with the host chip; and
when the companion chip is optically aligned with the host chip, curing an adhesive to affix the companion chip to the host chip while the pick-up tool is actively applying the stress compensation force to the companion chip.