CPC G01N 21/9501 (2013.01) [G01N 21/21 (2013.01); G01N 21/55 (2013.01); G01N 2201/121 (2013.01)] | 17 Claims |
1. A method of inspecting a wafer, the method comprising:
generating a reference incident light including a plurality of wavelengths;
measuring, by wavelength, an intensity of the reference incident light by the wavelengths and storing the measurement as stored reference incident light intensity;
irradiating the reference incident light to the wafer;
measuring, by wavelength, an intensity of a reference reflected light by the wavelengths and storing the measurement as stored reference reflected light intensity, the reference reflected light generated as a result of irradiating the reference incident light to the wafer;
generating an incident light including the plurality of wavelengths;
measuring, by wavelength, an intensity of the incident light and storing the measurement as stored incident light intensity;
irradiating the incident light to the wafer;
measuring, by wavelength, an intensity of a reflected light from the wafer and storing the measurement as stored reflected light intensity, the reflected light generated as a result of irradiating the incident light to the wafer;
determining a difference, at individual wavelengths, between the stored reflected light intensity and the stored reference reflected light intensity; and
correcting, by wavelength, the stored reflected light intensity based on the determined difference,
wherein there is a time lapse between when the stored reference reflected light intensity is measured and when the stored reflected light intensity is measured.
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