US 12,111,215 B2
Imaging device and calibration method
Takuro Kosaka, Kanagawa (JP); Naoki Kawazu, Kanagawa (JP); and Takumi Oka, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/309,873
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Dec. 9, 2019, PCT No. PCT/JP2019/048063
§ 371(c)(1), (2) Date Jun. 24, 2021,
PCT Pub. No. WO2020/144996, PCT Pub. Date Jul. 16, 2020.
Claims priority of application No. 2019-002937 (JP), filed on Jan. 10, 2019.
Prior Publication US 2022/0074797 A1, Mar. 10, 2022
Int. Cl. G01K 15/00 (2006.01); G01J 1/44 (2006.01); G01S 7/497 (2006.01); H04N 23/11 (2023.01); H04N 25/77 (2023.01)
CPC G01K 15/005 (2013.01) [H04N 23/11 (2023.01); H04N 25/77 (2023.01); G01J 2001/444 (2013.01); G01S 7/497 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An imaging device, comprising:
a pixel array unit including pixels;
an analog signal generation unit configured to generate an analog signal based on a temperature around the pixel array unit;
an analog to digital (A/D) conversion unit configured to convert the analog signal into a digital signal;
a switch configured to cut off the analog signal to be supplied to the A/D conversion unit; and
a correction unit configured to calculate a parameter of a correction calculation expression for correction of the digital signal based on a first digital signal obtained through A/D conversion from the analog signal cut off by the switch and based on a second digital signal obtained through the A/D conversion from the analog signal generated by the analog signal generation unit.