US 12,111,188 B2
Sense coil for inductive linear-position sensing, and related devices, systems, and methods
Ganesh Shaga, Telangana (IN); Surendra Akkina, Telangana (IN); and Sudheer Puttapudi, Telangana (IN)
Assigned to Microchip Technology Incorporated, Chandler, AZ (US)
Filed by Microchip Technology Incorporated, Chandler, AZ (US)
Filed on Jan. 24, 2022, as Appl. No. 17/648,743.
Claims priority of application No. 202141026176 (IN), filed on Jun. 11, 2021.
Prior Publication US 2022/0397427 A1, Dec. 15, 2022
Int. Cl. G01D 5/22 (2006.01); G01D 5/20 (2006.01)
CPC G01D 5/2275 (2013.01) [G01D 5/204 (2013.01); G01D 2205/77 (2021.05)] 25 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a support structure;
an electrically conductive material arranged at the support structure to define a continuous path for electrical current to flow between a first location and a second location, the continuous path comprising:
a first path portion on, or in, a plane of the support structure, the first path portion defining a first spiraling path of two or more spiraling loops for the electrical current to flow in a clockwise direction around a first axis, the first path portion comprising a first sense coil of an inductive position sensor;
a second path portion on, or in, the plane of the support structure and laterally spaced from the first path portion, the second path portion defining a second spiraling path of two or more spiraling loops for the electrical current to flow in a counter-clockwise direction around a second axis, the second path portion comprising a second sense coil of the inductive position sensor;
a first coupling portion on, or in, a first other plane parallel to the plane, the first coupling portion extending over, through vias, the two or more spiraling loops of the first path portion and the two or more spiraling loops of the second path portion for coupling an inner portion of the first path portion to an inner portion of the second path portion; and
a second coupling portion on, or in, a second other plane parallel to the plane, the second coupling portion for coupling, through vias, an outer portion of the second path portion to an outer portion of the first path portion.