US 12,110,594 B2
Composition for electroless platinum plating and electroless platinum plating method using the same
Kuan Soo Shin, Seoul (KR); Jeong Hei Choi, Uijeongbu-si (KR); Yoon Kyung Jung, Daejeon (KR); and Min Young Cho, Seoul (KR)
Assigned to FOUNDATION OF SOONGSIL UNIVERSITY-INDUSTRY COOPERATION, Seoul (KR)
Filed by FOUNDATION OF SOONGSIL UNIVERSITY-INDUSTRY COOPERATION, Seoul (KR)
Filed on Sep. 16, 2021, as Appl. No. 17/476,508.
Claims priority of application No. 10-2020-0131880 (KR), filed on Oct. 13, 2020; and application No. 10-2021-0096969 (KR), filed on Jul. 23, 2021.
Prior Publication US 2022/0112604 A1, Apr. 14, 2022
Int. Cl. C23C 18/44 (2006.01); C23C 18/16 (2006.01)
CPC C23C 18/44 (2013.01) [C23C 18/1641 (2013.01)] 4 Claims
OG exemplary drawing
 
1. An electroless platinum plating method, comprising:
preparing a composition for electroless platinum plating, the composition consisting of:
an alcohol;
an aqueous solution of chloroplatinic acid (H2PtCl6) included in the composition at a concentration of 6.3 to 7.9 mM; and
an aqueous solution of potassium hydroxide included in the composition at a concentration of 0.2 M;
dipping a substrate in the composition; and
shaking the composition at 100 to 200 rpm to form a platinum thin film on the substrate,
wherein the substrate is selected from the group consisting of glass, rubber, ceramic, paper, carbon paper, wood, and leaves.