US 12,110,428 B2
Adhesively joined structure and component for a vehicle
Masumi Koori, Tokyo (JP); Kohei Ueda, Tokyo (JP); Atsushi Morishita, Tokyo (JP); and Atsuo Koga, Tokyo (JP)
Assigned to NIPPON STEEL CORPORATION, Tokyo (JP)
Appl. No. 17/279,933
Filed by NIPPON STEEL CORPORATION, Tokyo (JP)
PCT Filed Sep. 27, 2019, PCT No. PCT/JP2019/038179
§ 371(c)(1), (2) Date Mar. 25, 2021,
PCT Pub. No. WO2020/067430, PCT Pub. Date Apr. 2, 2020.
Claims priority of application No. 2018-185842 (JP), filed on Sep. 28, 2018.
Prior Publication US 2021/0340407 A1, Nov. 4, 2021
Int. Cl. B32B 3/10 (2006.01); B32B 15/09 (2006.01); B32B 15/092 (2006.01); B32B 15/095 (2006.01); B32B 15/18 (2006.01); C09J 5/10 (2006.01)
CPC C09J 5/10 (2013.01) [B32B 15/09 (2013.01); B32B 15/092 (2013.01); B32B 15/095 (2013.01); B32B 15/18 (2013.01); B32B 2605/00 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An adhesively joined structure comprising:
a first member having a metal portion and a film portion disposed on at least a part of a surface of the metal portion;
a second member having a metal portion and a film portion disposed on at least a part of a surface of the metal portion of the second member;
an adhesive layer for joining the first member and the second member to each other via the film portion of the first member,
wherein the film portion of the first member includes
an organic resin phase containing one or more of a urethane group, an epoxy group, and an ester group;
an organic compound phase formed of an organic silicon compound; and
optionally an inorganic compound phase formed of an inorganic silicon compound,
a total volume percentage of the organic compound phase and the inorganic compound phase to a total volume of the film portion of the first member is 16 vol % to 84 vol %,
a volume percentage of the organic compound phase to the total volume of the film portion of the first member is 16 vol % to 84 vol %,
a volume percentage of the inorganic compound phase to the total volume of the film portion of the first member is limited to 10 vol % or less,
the organic silicon compound includes
a Si—C bond; and
a Si—O bond or a Si—OH bond or combination thereof.