US 12,110,413 B2
Coatings for waterproofing electronic components
John L. Zimmerman, Taylor, MI (US); John D. McGee, Troy, MI (US); Gregory T. Donaldson, Sterling Heights, MI (US); Thomas S. Smith, II, Novi, MI (US); William G. Kozak, Waterford, MI (US); Lisa K. Miller, Clinton Township, MI (US); and Eric C. Kuhns, Washington, MI (US)
Assigned to Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed by Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed on Sep. 22, 2021, as Appl. No. 17/448,404.
Application 17/448,404 is a continuation of application No. PCT/US2020/023764, filed on Mar. 20, 2020.
Claims priority of provisional application 62/822,545, filed on Mar. 22, 2019.
Prior Publication US 2022/0002559 A1, Jan. 6, 2022
Int. Cl. C09D 7/65 (2018.01); C09D 4/06 (2006.01); C09D 5/00 (2006.01); C09D 7/20 (2018.01); C09D 109/02 (2006.01); C09D 135/02 (2006.01); C09D 153/00 (2006.01); H05K 3/28 (2006.01)
CPC C09D 5/00 (2013.01) [C09D 4/06 (2013.01); C09D 7/20 (2018.01); C09D 7/65 (2018.01); C09D 109/02 (2013.01); C09D 135/02 (2013.01); C09D 153/00 (2013.01); H05K 3/282 (2013.01); H05K 3/284 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A circuit board water-proofing coating composition, comprising:
A) at least one dissolved and/or dispersed passivating agent containing a molecule comprising a thio-functional group and/or an azolic moiety, the passivating agent in a concentration greater than a solubility limit of the passivating agent in the binder component;
B) a dissolved and/or dispersed binder component comprising one or more of the following types of binders:
1) an organic or inorganic film-forming polymer that is unreactive with (A);
2) an organic or inorganic film-forming polymer, which is capable of reacting with (A);
3) one or more polymer pre-cursors polymerizable on a substrate surface and unreactive to (A);
4) one or more polymer pre-cursors polymerizable on a substrate surface and capable of reacting with (A); and
C) optionally, one or more dissolved and/or dispersed additive(s), selected from wax, adhesion promoter, leveling agent, flow modifier, wetting agent, rheology modifier, stabilizer, catalyst, pigment, photoinitiator, biocide and biostat; and
D) optionally at least one organic solvent.