US 12,110,408 B2
Conductive laminate and manufacturing method of conductive laminate
Kotaro Maeda, Kanagawa (JP); and Norihide Shimohara, Kanagawa (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Feb. 23, 2023, as Appl. No. 18/173,773.
Application 18/173,773 is a continuation of application No. PCT/JP2021/035589, filed on Sep. 28, 2021.
Claims priority of application No. 2020-165595 (JP), filed on Sep. 30, 2020.
Prior Publication US 2023/0212413 A1, Jul. 6, 2023
Int. Cl. C09D 11/52 (2014.01); B41M 5/00 (2006.01); C09D 1/00 (2006.01); C09D 11/322 (2014.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01)
CPC C09D 11/52 (2013.01) [B41M 5/0047 (2013.01); C09D 1/00 (2013.01); C09D 11/322 (2013.01); H05K 1/097 (2013.01); H05K 3/125 (2013.01)] 16 Claims
 
1. A conductive laminate comprising:
a base material; and
a conductive ink film provided on the base material,
wherein the conductive ink film has a first main surface and a second main surface, wherein the first main surface is closer to the base material than the second main surface and the second main surface is farther from the base material than the first main surface,
a region that extends from the first main surface toward the second main surface to a position being away from the first main surface by a distance equivalent to 50% of a thickness of the conductive ink film has a first void ratio of 15% to 50%,
a region that extends from a position being away from the second main surface toward the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film to the second main surface has a second void ratio which is smaller than the first void ratio,
the second void ratio is in a range of 4% to 30%, and
the conductive ink film comprises at least one metal selected from the group consisting of silver, gold, platinum, nickel, palladium, and copper.