US 12,110,356 B2
Heat-curable resin composition
Naoyuki Kushihara, Annaka (JP); and Rina Sasahara, Annaka (JP)
Assigned to SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed by Shin-Etsu Chemical Co., Ltd., Tokyo (JP)
Filed on Jul. 20, 2022, as Appl. No. 17/869,197.
Claims priority of application No. 2021-126422 (JP), filed on Aug. 2, 2021.
Prior Publication US 2023/0067259 A1, Mar. 2, 2023
Int. Cl. C08F 283/10 (2006.01); C09D 151/08 (2006.01); C09J 151/08 (2006.01)
CPC C08F 283/10 (2013.01) [C09D 151/08 (2013.01); C09J 151/08 (2013.01)] 15 Claims
 
1. A heat-curable resin composition comprising:
one or more of each of
(A) a citraconimide compound;
(B) an epoxy resin;
(C) an epoxy resin curing agent; and
(D) a curing accelerator,
wherein the epoxy resin curing agent (C) is at least one selected from an amine compound, a phenolic compound, an acid anhydride compound and an active ester compound.