US 12,109,813 B2
Liquid ejecting head and liquid ejecting apparatus
Motoki Takabe, Shiojiri (JP)
Assigned to Seiko Epson Corporation, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Dec. 1, 2022, as Appl. No. 18/060,691.
Claims priority of application No. 2021-196716 (JP), filed on Dec. 3, 2021.
Prior Publication US 2023/0173808 A1, Jun. 8, 2023
Int. Cl. B41J 2/14 (2006.01)
CPC B41J 2/14201 (2013.01) [B41J 2/14233 (2013.01); B41J 2002/14241 (2013.01); B41J 2002/14362 (2013.01); B41J 2002/14419 (2013.01); B41J 2002/14491 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A liquid ejecting head comprising:
a nozzle substrate including
a first nozzle configured to eject a liquid and
a second nozzle provided at a position adjacent to the first nozzle and configured to eject a liquid;
a pressure chamber substrate provided above the nozzle substrate and including
a first pressure chamber that communicates with the first nozzle and
a second pressure chamber that communicates with the second nozzle;
a first piezoelectric element formed from a common electrode, a first piezoelectric body, and a first individual electrode and configured to apply a pressure to a liquid in the first pressure chamber;
a second piezoelectric element formed from the common electrode, a second piezoelectric body, and a second individual electrode and configured to apply a pressure to a liquid in the second pressure chamber;
a sealing substrate provided above the pressure chamber substrate in such a way as to cover the first piezoelectric element and the second piezoelectric element;
a wiring board configured to apply a voltage to the common electrode, the first individual electrode, and the second individual electrode;
a first wiring portion provided above the pressure chamber substrate and configured to electrically couple the common electrode to the wiring board;
a second wiring portion provided at a lower surface of the sealing substrate and configured to electrically couple the common electrode to the wiring board; and
a third wiring portion provided between the first piezoelectric element and the second piezoelectric element and configured to electrically couple the first wiring portion to the second wiring portion.