US 12,109,752 B2
Composition for forming underlayer film in imprinting method, kit, pattern producing method, laminate, and method for manufacturing semiconductor element
Akihiro Hakamata, Haibara-gun (JP); Naoya Shimoju, Haibara-gun (JP); and Yuichiro Goto, Haibara-gun (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Sep. 24, 2021, as Appl. No. 17/484,492.
Application 17/484,492 is a continuation of application No. PCT/JP2020/012596, filed on Mar. 23, 2020.
Claims priority of application No. 2019-067816 (JP), filed on Mar. 29, 2019.
Prior Publication US 2022/0009152 A1, Jan. 13, 2022
Int. Cl. B29C 59/02 (2006.01); C08F 2/50 (2006.01); C08F 220/10 (2006.01); G03F 7/00 (2006.01); G03F 7/004 (2006.01); G03F 7/20 (2006.01)
CPC B29C 59/02 (2013.01) [C08F 2/50 (2013.01); C08F 220/10 (2013.01); G03F 7/0002 (2013.01); G03F 7/0045 (2013.01); G03F 7/0046 (2013.01); G03F 7/2004 (2013.01); G03F 7/2018 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A composition for forming an underlayer film in an imprinting method, comprising:
a high-molecular-weight compound having a polymerizable functional group; and
a monomer having a plurality of crosslinking functional groups capable of being bonded to the polymerizable functional group,
wherein a Hansen solubility parameter distance, which is a difference between a Hansen solubility parameter of the high-molecular-weight compound and a Hansen solubility parameter of the monomer, is 5.0 or less, and
regarding two crosslinking functional groups among the plurality of crosslinking functional groups, the number of atoms, which constitute a shortest atom chain mutually linking crosslinking points in the respective crosslinking functional groups, is 7 or more.