US 12,109,629 B1
Cutting tool
Fumiyoshi Kobayashi, Osaka (JP); Anongsack Paseuth, Osaka (JP); and Haruko Harada, Osaka (JP)
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 18/681,078
Filed by Sumitomo Electric Industries, Ltd., Osaka (JP)
PCT Filed Jul. 13, 2023, PCT No. PCT/JP2023/025928
§ 371(c)(1), (2) Date Feb. 5, 2024,
.
Int. Cl. B23B 27/14 (2006.01); C23C 16/34 (2006.01); C23C 16/36 (2006.01); C23C 16/40 (2006.01)
CPC B23B 27/148 (2013.01) [C23C 16/34 (2013.01); C23C 16/36 (2013.01); C23C 16/403 (2013.01); B23B 2228/105 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A cutting tool comprising a base material and a coating disposed on the base material, wherein
the coating comprises a hard particle layer,
the hard particle layer is formed from a plurality of hard particles consisting of titanium, silicon, carbon, and nitrogen,
the hard particle layer comprises a first region and a second region,
the first region is a region sandwiched between a first main surface of the hard particle layer facing forward the base material and a virtual surface S1 at a distance of 0.5 μm from the first main surface toward the hard particle layer,
the second region is a region sandwiched between a second main surface of the hard particle layer opposite to the first main surface and a virtual surface S2 at a distance of 0.5 μm from the second main surface toward the hard particle layer,
a composition of the first region is Ti(1-Xb)SiXbCN,
a composition of the second region is Ti(1-Xs)SiXsCN,
the Xs and the Xb satisfy relationships of Xs-Xb≥0.01 and 0<Xb<Xs≤0.10,
the hard particles have a cubic crystal structure, and
in the hard particles, a concentration of the silicon changes periodically along a first direction going from the first main surface to the second main surface.