US 12,109,597 B2
Substrate treatment device
Daisuke Matsushima, Yokohama (JP); Kensuke Demura, Yokohama (JP); Satoshi Nakamura, Yokohama (JP); Masaya Kamiya, Yokohama (JP); and Minami Nakamura, Yokohama (JP)
Assigned to SHIBAURA MECHATRONICS CORPORATION, Kanagawa (JP)
Filed by Shibaura Mechatronics Corporation, Yokohama (JP)
Filed on Apr. 14, 2021, as Appl. No. 17/230,152.
Claims priority of application No. 2020-072771 (JP), filed on Apr. 15, 2020; application No. 2021-004935 (JP), filed on Jan. 15, 2021; and application No. 2021-065606 (JP), filed on Apr. 8, 2021.
Prior Publication US 2021/0323036 A1, Oct. 21, 2021
Int. Cl. B08B 7/00 (2006.01); B08B 3/04 (2006.01); B08B 3/08 (2006.01); B08B 3/10 (2006.01); F25C 1/12 (2006.01); H01L 21/67 (2006.01)
CPC B08B 7/0014 (2013.01) [B08B 3/041 (2013.01); B08B 3/08 (2013.01); B08B 3/10 (2013.01); F25C 1/12 (2013.01); H01L 21/67028 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A substrate treatment device, comprising:
a placement stand configured to rotate the substrate, the substrate including a first surface and a second surface opposite the first surface, the first surface facing the placement stand;
a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate;
a first liquid supplier configured to supply a first liquid on the second surface of the substrate;
a second liquid supplier configured to supply a second liquid on the second surface of the substrate, the second liquid being more conductive than the first liquid; and
a controller controlling rotation of the substrate, supply of the cooling gas, supply of the first liquid, and supply of the second liquid,
the controller being configured to perform following steps;
a preliminary step of supplying the second liquid on the second surface of the substrate, a temperature of the second liquid being higher than a freezing point of the first liquid, and supplying the cooling gas into the space between the placement stand and the substrate,
a liquid film forming step of forming a liquid film by supplying the first liquid toward the second surface of the substrate after the preliminary step,
a supercooling step of putting the liquid film on the second surface of the substrate in a supercooled state, and
a freezing step of freezing at least a part of the liquid film on the second surface of the substrate,
in the liquid film forming step,
after stopping the supply of the second liquid,
rotating the substrate at a rotational speed of the preliminary step to discharge at least a part of the second liquid supplied to the second surface of the substrate,
after discharging at least part of the second liquid, setting a first rotational speed slower than the rotational speed in the preliminary step, and then supplying the first liquid toward the second surface of the substrate, and
in the freezing step, the liquid film has a layer comprising only the first liquid if the second liquid is completely discharged in the liquid film forming step, or the liquid film has a layer comprising the first liquid and the second liquid if a part of the second liquid is left in the liquid film forming step.