US 12,109,423 B2
Method for producing a medical implant
Fabian Kimmig, Freiburg (DE); Tim Boretius, Freiburg (DE); and Florian Adami, Freiburg (DE)
Assigned to Neuroloop GmbH, Freiburg (DE)
Appl. No. 17/438,563
Filed by Neuroloop GmbH, Freiburg (DE)
PCT Filed Mar. 2, 2020, PCT No. PCT/EP2020/055465
§ 371(c)(1), (2) Date Sep. 13, 2021,
PCT Pub. No. WO2020/182525, PCT Pub. Date Sep. 17, 2020.
Claims priority of application No. 10 2019 203 273.7 (DE), filed on Mar. 11, 2019.
Prior Publication US 2022/0143413 A1, May 12, 2022
Int. Cl. B29C 70/88 (2006.01); A61N 1/375 (2006.01); B29C 45/14 (2006.01); B29C 70/72 (2006.01)
CPC A61N 1/3754 (2013.01) [B29C 45/14639 (2013.01); B29C 70/72 (2013.01); B29C 70/88 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method for the production of a medical implant, having a head section, including at least one blind hole recess electrical plug-in contact socket, containing at least one electrical contact, and a supply section, connected to the head section which includes at least one electrical component, that is electrically connected to the at least one electrical contact by at least one electrical conductor, comprising:
producing a fixing plate comprising a curable casting compound having an upper plate face and a lower plate face in which at least one electrical conductor is fixed and which projects through the upper and lower plate faces;
positioning the fixing plate in a casting mold in which the lower plate face forms part of a surface of the casting mold;
establishing electrical contact between at least one electrical conductor and the at least one electrical component, before or after the positioning of the fixing plate, which is part of a surface partially bounding the casting mold; and
producing the supply section by encapsulating the at least one electrical component and the at least one electrical conductor, which projects beyond the lower plate face, in a curable casting compound, to form a material bond with the lower plate face of the fixing plate.