US 12,109,166 B2
Cooling and heating massager
Quanqin Dai, Walnut, CA (US); Yong Yu, Diamond Bar, CA (US); and Guorong Xu, Yuyao (CN)
Assigned to MerchSource, LLC, Irvine, CA (US)
Filed by ThreeSixty Sourcing Limited, Hong Kong (CN)
Filed on Nov. 7, 2022, as Appl. No. 17/982,324.
Application 17/982,324 is a continuation of application No. 16/675,718, filed on Nov. 6, 2019, granted, now 11,877,976.
Prior Publication US 2023/0090085 A1, Mar. 23, 2023
Int. Cl. A61H 23/02 (2006.01); A61F 7/00 (2006.01); A61H 23/00 (2006.01)
CPC A61H 23/0254 (2013.01) [A61F 7/00 (2013.01); A61H 23/006 (2013.01); A61H 23/0263 (2013.01); A61F 2007/0064 (2013.01); A61H 2201/0207 (2013.01); A61H 2201/0214 (2013.01); A61H 2201/025 (2013.01); A61H 2201/149 (2013.01); A61H 2201/5025 (2013.01); A61H 2209/00 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A portable percussion massager comprising:
a housing;
a motor positioned within the housing that is rotatably coupled to a connecting rod;
a pushing rod coupled to the connecting rod for creating a percussive massage effect; and
a temperature-controlled massage attachment electrically and removably coupled to the pushing rod at its end opposite attachment to the connecting rod, the temperature-controlled massage attachment includes an attachment housing, the attachment housing having a fan and a semiconductor positioned within the attachment housing, where the semiconductor, upon activation, cools the temperature-controlled massage attachment, where the fan is activated only when the semiconductor is cooling the temperature-controlled massage attachment, and where the attachment housing further includes a skin contact medium for covering the semiconductor to prevent direct contact by a user with the semiconductor.