US 11,785,782 B1
Embedded memory with encapsulation layer adjacent to a memory stack
Noriyuki Sato, Hillsboro, OR (US); Tanay Gosavi, Portland, OR (US); Niloy Mukherjee, San Ramon, CA (US); Rajeev Kumar Dokania, Beaverton, OR (US); Amrita Mathuriya, Portland, OR (US); and Sasikanth Manipatruni, Portland, OR (US)
Assigned to KEPLER COMPUTING INC., San Francisco, CA (US)
Filed by Kepler Computing Inc., San Francisco, CA (US)
Filed on Jun. 11, 2021, as Appl. No. 17/346,094.
Application 17/346,094 is a continuation of application No. 17/345,964, filed on Jun. 11, 2021.
Int. Cl. H10B 53/40 (2023.01)
CPC H10B 53/40 (2023.02) 19 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first memory material stack;
a first pedestal comprising metal connected to a first portion of the first memory material stack;
a second memory material stack;
a second pedestal comprising metal connected to a first portion of the second memory material stack;
a hard mask having a first portion over the first memory material stack, wherein the hard mask having a second portion over the second memory material stack; and
an encapsulation material coupled to the first memory material stack, the second memory material stack, the first portion of the hard mask, and the second portion of the hard mask, wherein the encapsulation material completely fills a region between the first memory material stack and the second memory material stack.