CPC H10B 53/40 (2023.02) | 19 Claims |
1. An apparatus comprising:
a first memory material stack;
a first pedestal comprising metal connected to a first portion of the first memory material stack;
a second memory material stack;
a second pedestal comprising metal connected to a first portion of the second memory material stack;
a hard mask having a first portion over the first memory material stack, wherein the hard mask having a second portion over the second memory material stack; and
an encapsulation material coupled to the first memory material stack, the second memory material stack, the first portion of the hard mask, and the second portion of the hard mask, wherein the encapsulation material completely fills a region between the first memory material stack and the second memory material stack.
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