US 11,785,746 B2
Server design with high reliability cooling hardware
Tianyi Gao, San Jose, CA (US)
Assigned to BAIDU USA LLC, Sunnyvale, CA (US)
Filed by BAIDU USA LLC, Sunnyvale, CA (US)
Filed on Sep. 24, 2021, as Appl. No. 17/484,079.
Prior Publication US 2023/0096919 A1, Mar. 30, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20763 (2013.01) [H05K 7/20254 (2013.01); H05K 7/20272 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling device, comprising:
an elongated chassis;
a cooling plate integrated and contained within the elongated chassis of the cooling device;
a fluid distribution channel integrated within the elongated chassis to provide cooling liquid to the cooling plate;
fluid connectors, wherein the fluid connectors receive the cooling liquid from a coolant distribution device; and
a blocking channel disposed between the cooling plate and the fluid connectors, wherein the blocking channel mates with a blocking plate of the coolant distribution device.